Liquid immersion member, exposure apparatus, exposure method, device fabricating method, program, and recording medium

ABSTRACT

A liquid immersion exposure apparatus includes a liquid immersion member which forms a liquid immersion space under an emitting surface of a last optical member. The exposure light is projected to a substrate through liquid in the liquid immersion space to expose the substrate while the substrate is moved in a scanning direction. The liquid immersion member includes (i) a first member having a liquid supply port and an opening through which the exposure light is projected, and (ii) a second member having a liquid recovery port facing downwardly and that is movable with respect to the first member. The liquid recovery port has a plurality of openings disposed in a four-sided shaped having four corners to surround the opening of the first member.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a Divisional of U.S. application Ser. No. 15/095,500 filed Apr.11, 2016 now U.S. Pat. No. 9,810,999, which in turn is a Divisional ofU.S. application Ser. No. 13/793,667 filed Mar. 11, 2013 (now U.S. Pat.No. 9,323,160), which in turn is a non-provisional of U.S. ProvisionalApplication No. 61/622,235, filed on Apr. 10, 2012. The entire contentsof the prior applications are incorporated herein by reference in theirentireties.

BACKGROUND Field of the Invention

The present invention relates to a liquid immersion member, an exposureapparatus, an exposure method, a device fabricating method, program, anda recording medium.

Description of Related Art

In exposure apparatuses used for a photolithography process, a liquidimmersion exposure apparatus that exposes a substrate with exposurelight through liquid is known, for example, as disclosed in thefollowing U.S. Pat. No. 7,864,292.

SUMMARY

In a liquid immersion exposure apparatus, for example, when liquid flowsout from a predetermined space or remains on an object such as asubstrate, there is a possibility of a defective exposure beinggenerated. As a result, there is a possibility of a defective devicebeing generated.

An object of the present invention is to provide a liquid immersionmember, an exposure apparatus, and an exposure method, which are capableof suppressing the generation of a defective exposure. In addition,another object of the present invention is to provide a devicefabricating method, a program, and a recording medium which are capableof suppressing generation of a defective device.

According to a first aspect of the present invention, there is provideda liquid immersion member in which a liquid immersion space is formed onan object movable below an optical member so that a light path ofexposure light emitted from an emission surface of the optical member isfilled with liquid, which includes: a first member which is disposed inat least a portion of the periphery of the optical member; and a secondmember which is movable below the first member to interpose a gaptherebetween and which includes a recovery port that recovers at least aportion of the liquid in the liquid immersion space.

According to a second aspect of the present invention, there is provideda liquid immersion member in which a liquid immersion space is formed onan object movable below an optical member so that a light path ofexposure light emitted from an emission surface of the optical member isfilled with liquid, comprising: a first member which is disposed in atleast a portion of the periphery of the optical member; and a secondmember, movable at the outside of at least a portion of the first memberwith respect to the light path of the exposure light, which includes arecovery port that recovers at least a portion of the liquid of theliquid immersion space.

According to a third aspect of the present invention, there is providedan exposure apparatus that exposes a substrate with exposure lightthrough liquid, including: the liquid immersion member according to thefirst aspect.

According to a fourth aspect of the present invention, there is provideda device fabricating method which includes the steps of: exposing asubstrate using the exposure apparatus according to any one of the firstto third aspects; and developing the exposed substrate.

According to a fifth aspect of the present invention, there is providedan exposure method for exposing a substrate with exposure light throughliquid, which includes the steps of: forming a liquid immersion space sothat a light path of the exposure light emitted from an emission surfaceof an optical member is filled with the liquid; exposing the substratewith the exposure light emitted from the emission surface through theliquid in the liquid immersion space; and moving a second member whichis disposed below a first member to maintain a gap with respect to thefirst member disposed in at least a portion of the periphery of theoptical member and which includes a recovery port that recovers at leasta portion of the liquid in the liquid immersion space.

According to a sixth aspect of the present invention, here is provided adevice fabricating method which includes the steps of: exposing asubstrate using the exposure method according to the fifth aspect; anddeveloping the exposed substrate.

According to a seventh aspect of the present invention, there isprovided a program causing a computer to execute control of an exposureapparatus that exposes a substrate with exposure light through liquid,the program including the steps of: forming a liquid immersion space sothat a light path of the exposure light emitted from an emission surfaceof an optical member is filled with the liquid; exposing the substratewith the exposure light emitted from the emission surface through theliquid in the liquid immersion space; and moving a second member whichis disposed below a first member to maintain a gap with respect to thefirst member disposed in at least a portion of the periphery of theoptical member and which includes a recovery port that recovers at leasta portion of the liquid in the liquid immersion space.

According to a eighth aspect of the present invention, there is provideda computer readable recording medium having the program according to theseventh aspect recorded thereon.

According to the aspects of the present invention, it is possible tosuppress the generation of a defective exposure. In addition, accordingto the aspects of the present invention, it is possible to suppressgeneration of a defective device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram illustrating an example of an exposure apparatusaccording to a first embodiment.

FIG. 2 is a side cross-sectional view illustrating an example of aliquid immersion member according to the first embodiment.

FIG. 3 is a diagram when the liquid immersion member according to thefirst embodiment is viewed from the lower side.

FIG. 4 is a side cross-sectional view illustrating a portion of theliquid immersion member according to the first embodiment.

FIG. 5 is a diagram illustrating an example of an operation of theliquid immersion member according to the first embodiment.

FIG. 6 is a diagram illustrating an example of an operation of theliquid immersion member according to the first embodiment.

FIG. 7 is a diagram illustrating an example of an operation of theexposure apparatus according to the first embodiment.

FIG. 8 is a schematic diagram illustrating an example of an operation ofthe exposure apparatus according to the first embodiment.

FIG. 9 is a schematic diagram illustrating an example of an operation ofthe liquid immersion member according to the first embodiment.

FIG. 10 is a schematic diagram illustrating an example of an operationof the liquid immersion member according to the first embodiment.

FIG. 11 is a diagram illustrating an example of a velocity profile.

FIG. 12 is a diagram illustrating an example of the velocity profile.

FIG. 13 is a schematic diagram illustrating an example of an operationof the exposure apparatus according to the first embodiment.

FIG. 14 is a side cross-sectional view illustrating an example of aliquid immersion member according to a second embodiment.

FIG. 15 is a side cross-sectional view illustrating an example of aliquid immersion member according to a third embodiment.

FIG. 16 is a diagram when a liquid immersion member according to afourth embodiment is viewed from the lower side.

FIG. 17 is a diagram when a liquid immersion member according to a fifthembodiment is viewed from the lower side.

FIG. 18 is a diagram illustrating an example of a substrate stage.

FIG. 19 is a flow diagram illustrating an example of a devicefabricating method.

DESCRIPTION OF EMBODIMENTS

Hereinafter, embodiments of the present invention will be described withreference to the drawings, but the present invention is not limitedthereto. In the following description, an XYZ orthogonal coordinatesystem is set, and a positional relationship of each part will bedescribed with reference to the XYZ orthogonal coordinate system. Apredetermined direction within the horizontal plane is set to an X-axisdirection, a direction orthogonal to the X-axis direction within thehorizontal plane is set to a Y-axis direction, and a direction (that is,vertical direction) orthogonal to the X-axis direction and the Y-axisdirection, respectively, is set to a Z-axis direction. In addition,rotational (tilting) directions around the X-axis, the Y-axis, and theZ-axis are set to a θX direction, a θY direction, and a θZ direction,respectively.

First Embodiment

A first embodiment will be described below. FIG. 1 is a schematicconfiguration diagram illustrating an example of an exposure apparatusEX according to the first embodiment. The exposure apparatus EX of thepresent embodiment is a liquid immersion exposure apparatus that exposesa substrate P with exposure light EL through exposure liquid LQ. In thepresent embodiment, a liquid immersion space LS is formed so that alight path K of exposure light EL with which the substrate P isirradiated is filled with the liquid LQ. The liquid immersion space LSis a portion (a space or a region) which is filled with liquid. Thesubstrate P is exposed with the exposure light EL through the exposureliquid LQ of the liquid immersion space LS. In the present embodiment,water (pure water) is used as the exposure liquid LQ.

In addition, the exposure apparatus EX of the present embodiment is, forexample, an exposure apparatus including a substrate stage and ameasurement stage as disclosed in U.S. Pat. No. 6,897,963, EP PatentApplication Publication No. 1,713,113 and the like.

In FIG. 1, the exposure apparatus EX includes a movable mask stage 1that holds a mask M, a movable substrate stage 2 that holds thesubstrate P, a movable measurement stage 3 on which a measurement member(measurement instrument) C measuring the exposure light EL is mountedwithout holding the substrate P, a measurement system 4 that measurespositions of the substrate stage 2 and the measurement stage 3, anillumination system IL that illuminates the mask M with the exposurelight EL, a projection optical system PL that projects an image of apattern of the mask M, illuminated with the exposure light EL, onto thesubstrate P, a liquid immersion member 5 that forms the liquid immersionspace LS, a control device 6 that controls an operation of the entireexposure apparatus EX, and a storage device 7, connected to the controldevice 6, which stores various types of information about an exposure.

In addition, the exposure apparatus EX includes a basic frame 8A thatsupports various types of measurement systems including the projectionoptical system PL and the measurement system 4, a device frame 8B thatsupports the basic frame 8A, a vibration-proofing device 10, disposedbetween the basic frame 8A and the device frame 8B, which suppresses thetransmission of a vibration to the basic frame 8A from the device frame8B, and a chamber device 9 that adjusts the environment (at least one oftemperature, humidity, pressure, and cleanliness level) of a space CS towhich the exposure light EL travels. At least the projection opticalsystem PL, the liquid immersion member 5, the substrate stage 2, and themeasurement stage 3 are disposed at the space CS. In the presentembodiment, the mask stage 1 and at least a portion of the illuminationsystem IL are also disposed at the space CS. The vibration-proofingdevice 10 includes a spring gear and the like. In the presentembodiment, the vibration-proofing device 10 includes a pneumatic spring(for example, air mount). Meanwhile, a detection system that detects analignment mark on the substrate P or a detection system that detects aposition of the object surface such as the substrate P may be supportedby the basic frame 8A.

The mask M includes a reticle on which a device pattern projected ontothe substrate P is formed. The mask M includes a transmissive maskhaving, for example, a transparent plate such as a glass plate, and apattern formed on the transparent plate using a light-shielding materialsuch as chromium. Meanwhile, a reflective mask can be used as the maskM.

The substrate P is a substrate for manufacturing a device. The substrateP includes, for example, a base material such as a semiconductor wafer,and a photosensitive film formed on the base material. Thephotosensitive film is a film of a photosensitive material(photoresist). In addition, the substrate P may include another film inaddition to the photosensitive film. For example, the substrate P mayinclude an antireflection film, and may include a protective film(top-coat film) that protects the photosensitive film.

The illumination system IL irradiates a predetermined illuminationregion IR with the exposure light EL. The illumination region IRincludes a position which can be irradiated with the exposure light ELemitted from the illumination system IL. The illumination system ILilluminates at least a portion of the mask M disposed at theillumination region IR with the exposure light EL having a uniformilluminance distribution. As the exposure light EL emitted from theillumination system IL, for example, far-ultraviolet light (DUV light)such as emission lines (g line, h line, and i line) emitted from amercury lamp and KrF excimer laser light (wavelength 248 nm), ArFexcimer laser light (wavelength 193 nm), vacuum-ultraviolet light (VUVlight) such as F₂ laser light (wavelength 157 nm), and the like areused. In the present embodiment, as the exposure light EL, ArF excimerlaser light which is ultraviolet light (vacuum-ultraviolet light) isused.

The mask stage 1 can move in a state where the mask M is held. The maskstage 1 moves by the operation of a drive system 11 including a planarmotor, for example, as disclosed in U.S. Pat. No. 6,452,292. In thepresent embodiment, the mask stage 1 can move in six directions of theX-axis, Y-axis, Z-axis, θX, θY, and θZ by the operation of the drivesystem 11. Meanwhile, the drive system 11 may not include a planarmotor. For example, the drive system 11 may include a linear motor.

The projection optical system PL irradiates a predetermined projectionregion PR with the exposure light EL. The projection region PR includesa position which can be irradiated with the exposure light EL emittedfrom the projection optical system PL. The projection optical system PLprojects an image of a pattern of the mask M, at a predeterminedprojection magnification, onto at least a portion of the substrate Pdisposed at the projection region PR. The projection optical system PLof the present embodiment is a reduction system of which the projectionmagnification is, for example, ¼, ⅕, ⅛ or the like. Meanwhile, theprojection optical system PL may be any of an equalization system and amagnification system. In the present embodiment, the optical axis of theprojection optical system PL is parallel to the Z-axis. In addition, theprojection optical system PL may be any of a refraction system whichdoes not include a reflective optical element, a reflection system whichdoes not include a refractive optical element, and a reflection andrefraction system which includes a reflective optical element and arefractive optical element. In addition, the projection optical systemPL may form any of an inverted image and an erected image.

The projection optical system PL includes a terminal optical element 13having an emission surface 12 from which the exposure light EL isemitted. The emission surface 12 emits the exposure light EL toward theimage plane of the projection optical system PL. The terminal opticalelement 13 is an optical element which is closest to the image plane ofthe projection optical system PL among a plurality of optical elementsof the projection optical system PL. The projection region PR includes aposition which can be irradiated with the exposure light EL emitted fromthe emission surface 12. In the present embodiment, the emission surface12 is directed toward the −Z-axis direction, and is parallel to the XYplane. Meanwhile, the emission surface 12 directed toward the −Z-axisdirection may be a convex surface, and may be a concave surface.Meanwhile, the emission surface 12 may be inclined with respect to theXY plane, and may include a curved surface. In the present embodiment,the optical axis of the terminal optical element 13 is parallel to theZ-axis. In the present embodiment, the exposure light EL emitted fromthe emission surface 12 travels in the −Z-axis direction.

The substrate stage 2 can move within the XY plane including a position(projection region PR) which can be irradiated with the exposure lightEL from the emission surface 12 in a state where the substrate P isheld. The measurement stage 3 can move within the XY plane including aposition (projection region PR) which can be irradiated with theexposure light EL from the emission surface 12 in a state where themeasurement member (measurement instrument) C is mounted. The substratestage 2 and the measurement stage 3 can move on a guide surface 14G of abase member 14. In the present embodiment, the guide surface 14G and theXY plane are substantially parallel to each other.

In the present embodiment, the substrate stage 2 includes a firstholding portion that releasably holds the substrate P and a secondholding portion, disposed at the periphery of the first holding portion,which releasably holds a cover member T as disclosed, for example, inU.S. Patent Application Publication No. 2007/0177125, U.S. PatentApplication Publication No. 2008/0049209, and the like. The firstholding portion holds the substrate P so that the surface (uppersurface) of the substrate P and the XY plane are substantially parallelto each other. In the present embodiment, the upper surface of thesubstrate P held by the first holding portion and the upper surface ofthe cover member T held by the second holding portion are disposed atsubstantially the same plane. Meanwhile, the upper surface of thesubstrate P held by the first holding portion and the upper surface ofthe cover member T held by the second holding portion may be disposedwithin the same plane, the upper surface of the cover member T may beinclined with respect to the upper surface of the substrate P, and theupper surface of the cover member T may include a curved surface.

The substrate stage 2 and the measurement stage 3 move by the operationof a drive system 15 including a planar motor as, for example, disclosedin U.S. Pat. No. 6,452,292. The drive system 15 includes a slider 2Cdisposed at the substrate stage 2, a slider 3C disposed at themeasurement stage 3, and a stator 14M disposed at the base member 14.The substrate stage 2 and the measurement stage 3 can move in sixdirections of the X-axis, Y-axis, Z-axis, θX, θY, and θZ on the guidesurface 14G by the operation of the drive system 15. Meanwhile, thedrive system 15 may not include a planar motor. For example, the drivesystem 15 may include a linear motor.

The measurement system 4 includes an interferometer system. Theinterferometer system includes a unit that irradiates a measurementmirror of the substrate stage 2 and a measurement mirror of themeasurement stage 3 with measurement light and measures the positions ofthe substrate stage 2 and the measurement stage 3. Meanwhile, themeasurement system may include an encoder system, for example, asdisclosed in Specification of U.S. Patent Application Publication No.2007/0288121. Meanwhile, the measurement system 4 may include only anyone of the interferometer system and the encoder system.

When an exposure process of the substrate P is performed, or when apredetermined measurement process is performed, the control device 6controls the positions of the substrate stage 2 (substrate P) and themeasurement stage 3 (measurement member C) on the basis of themeasurement result of the measurement system 4.

Next, the liquid immersion member 5 according to the present embodimentwill be described. FIG. 2 is a side cross-sectional view illustrating anexample of the liquid immersion member 5 according to the presentembodiment. FIG. 3 is a diagram when the liquid immersion member 5 isviewed from the lower side (−Z-axis side). FIG. 4 is an enlarged viewillustrating a portion of FIG. 2. Meanwhile, in the present embodiment,the liquid immersion member 5 is supported by the device frame 8Bthrough a supporter 50.

The liquid immersion member 5 forms the liquid immersion space LS sothat the light path K of the exposure light EL emitted from the emissionsurface 12 of the terminal optical element 13 is filled with the liquidLQ. A portion of the liquid immersion space LS is formed between theliquid immersion member 5 and an object capable of moving within the XYplane including a position facing the emission surface 12.

The object capable of moving within the XY plane including a positionfacing the emission surface 12 includes an object capable of facing theemission surface 12, and includes an object capable of being disposed atthe projection region PR. In addition, the object includes an objectmovable below the terminal optical element 13. In the presentembodiment, the object includes at least one of at least a portion (forexample, cover member T of the substrate stage 2) of the substrate stage2, the substrate P held by the substrate stage 2 (first holdingportion), and the measurement stage 3. In the exposure of the substrateP, the liquid immersion space LS is formed so that the light path K ofthe exposure light EL with which the substrate P is irradiated is filledwith the liquid LQ. When the substrate P is irradiated with the exposurelight EL, the liquid immersion space LS is formed so that only a regionof a portion of the surface of the substrate P including the projectionregion PR is covered with the liquid LQ.

In the following description, the object facing the emission surface 12is the substrate P. Meanwhile, as mentioned above, the object capable offacing the emission surface 12 may be at least one of the substratestage 2 and the measurement stage 3, and may be a separate object fromthe substrate P, the substrate stage 2, and the measurement stage 3. Inaddition, the liquid immersion space LS may be formed so as to straddlethe cover member T of the substrate stage 2 and the substrate P, and theliquid immersion space LS may be formed so as to straddle the substratestage 2 and the measurement stage 3.

In the present embodiment, the liquid immersion member 5 includes afirst member 21 disposed in at least a portion of the periphery of theterminal optical element 13 (light path of the exposure light EL), and asecond member 22 having a recovery port 24 that recovers the liquid LQ.At least a portion of the second member 22 is disposed below the firstmember 21. At least a portion of the first member 21 is disposed at aposition which is further apart from the substrate P (object) than thesecond member 22. The second member 22 is disposed between at least aportion of the first member 21 and the substrate P (object). Inaddition, at least a portion of the second member 22 is disposed at theoutside of the first member 21 with respect to the light path (opticalaxis of the terminal optical element 13) of the exposure light EL. Inthe present embodiment, the light path of the exposure light EL includesa light path of the exposure light EL (light path of the exposure lightEL proceeding through the terminal optical element 13) in the terminaloptical element 13. In addition, the light path of the exposure light ELincludes the light path K of the exposure light EL emitted from theemission surface 12. In the present embodiment, the first member 21 isdisposed in at least a portion of the periphery of the terminal opticalelement 13 (light path of the exposure light EL in the terminal opticalelement 13). Meanwhile, the first member 21 may be not disposed in theperiphery of the terminal optical element 13, but may be disposed in atleast a portion of the periphery of the light path K of the exposurelight EL emitted from the emission surface 12. The first member 21 maybe disposed in at least a portion of the periphery of the terminaloptical element 13, and in at least a portion of the periphery of thelight path K of the exposure light EL emitted from the emission surface12.

In addition, in the present embodiment, the liquid immersion member 5includes a supply port 23 that supplies the liquid LQ for forming theliquid immersion space LS. The supply port 23 is disposed at the insideof the recovery port 24 with respect to the radiation direction for theoptical axis (light path K) of the terminal optical element 13. In thepresent embodiment, the supply port 23 is disposed at the first member21. The supply port 23 is disposed further upward than the recovery port24. Meanwhile, the supply port 23 may be disposed at the second member22, and may be disposed at both the first member 21 and the secondmember 22.

In the present embodiment, the first member 21 is disposed in at least aportion of the periphery of the terminal optical element 13 with a gapinterposed therebetween. In the present embodiment, the first member 21is annular. In the present embodiment, a portion of the first member 21is disposed at the periphery of the terminal optical element 13, and aloop-shaped gap is formed between the terminal optical element 13 andthe first member 21. The shape of the gap may be circular, or may benon-circular.

In addition, in the present embodiment, a portion of the first member 21is disposed below the emission surface 12. That is, a portion of thefirst member 21 is disposed at the periphery of the light path K betweenthe emission surface 12 and the upper surface of the substrate P(object).

The first member 21 includes a first portion 211 of which at least aportion faces the emission surface 12 of the terminal optical element13, a second portion 212 of which at least a portion is disposed at theperiphery of an external surface 16 of the terminal optical element 13,and a third portion 213 disposed at the periphery of the second portion212. The external surface 16 of the terminal optical element 13 does notemit the exposure light EL. In other words, the exposure light EL doesnot pass through the external surface 16. In the present embodiment, inat least a portion of the periphery of the optical axis (light path K)of the terminal optical element 13, the external surface 16 is inclinedupward toward the outside with respect to the radiation direction forthe optical axis (light path K) of the terminal optical element 13.

The third portion 213 is disposed further upward than the first portion211. In addition, the third portion 213 is disposed at the outside ofthe first portion 211 with respect to the radiation direction for theoptical axis (light path K) of the terminal optical element 13.

Meanwhile, the first member 21 may not include the first portion 211.For example, the first member 21 may be disposed further upward than theemission surface 12. In addition, the first member 21 may not includethe second portion 212. For example, the first member 21 (first portion211 and third portion 213) may be disposed below the emission surface12.

In the present embodiment, the first member 21 is supported by thedevice frame 8B through the supporter 50. In the present embodiment, thesupporter 50 and the third portion 213 are connected to each other.Meanwhile, when the first member 21 does not include the third portion213, the supporter 50 may be connected to at least a portion of thefirst member 21. The position of the device frame 8B is substantiallyfixed. The supporter 50 supports the first member 21 above the substrateP (object). The supporter 50 supports the first member 21 so that a gapis formed between the terminal optical element 13 and the first member21. The position of the projection optical system PL (terminal opticalelement 13) is substantially fixed. The position of the first member 21is also substantially fixed. That is, in the present embodiment, theterminal optical element 13 and the first member 21 do not substantiallymove. The relative positions of the terminal optical element 13 and thefirst member 21 do not change.

The first member 21 includes an opening 21H allowing the exposure lightEL emitted from the emission surface 12 to pass therethrough. The firstportion 211 includes the opening 23H. In addition, the first member 21includes an upper surface 21A of which at least a portion faces theemission surface 12, and a lower surface 21B facing in the oppositedirection to that of the upper surface 21A. The first portion 211includes the upper surface 21A and the lower surface 21B. The uppersurface 21A and the emission surface 12 face each other with a gaptherebetween. The substrate P (object) can face the lower surface 21Bwith a gap therebetween. The upper surface 21A is disposed at theperiphery of the upper end of the opening 21H. The lower surface 21B isdisposed at the periphery of the lower end of the opening 21H. In thepresent embodiment, the upper surface 21A is substantially parallel tothe XY plane. The lower surface 21B is substantially parallel to the XYplane. The lower surface 21B can hold the liquid LQ between thesubstrate P (object) and the lower surface.

In addition, the first member 21 includes an internal surface 21C,disposed at the periphery of the upper surface 21A, which faces theexternal surface 16 of the terminal optical element 13, and an externalsurface 21D facing in the opposite direction to that of the internalsurface 21C. The external surface 21D is disposed at the periphery ofthe lower surface 21B. The second portion 212 includes the internalsurface 21C and the external surface 21D. The external surface 16 andthe internal surface 21C face each other with a gap therebetween. Theinternal surface 21C and the external surface 21D are inclined upwardtoward the outside with respect to the radiation direction for theoptical axis (light path K) of the terminal optical element 13.Meanwhile, at least one of the internal surface 21C and the externalsurface 21D may be parallel to the optical axis of the terminal opticalelement 13 (parallel to the Z-axis).

In addition, the first member 21 includes an upper surface 21E disposedat the periphery of the internal surface 21C, and a lower surface 21Gfacing in the opposite direction to that of the upper surface 21E. Thethird portion 213 includes the upper surface 21E and the lower surface21G. The lower surface 21G is disposed at the periphery of the externalsurface 21D. The external surface 21D is disposed so as to link theouter edge of the lower surface 21B to the inner edge of the lowersurface 21G. In the present embodiment, the upper surface 21E and thelower surface 21G are substantially parallel to the XY plane, but maynot be parallel thereto.

The second member 22 can move with respect to the first member 21. Inaddition, the second member 22 can move with respect to the terminaloptical element 13. That is, in the present embodiment, the relativepositions of the second member 22 and the first member 21 change. Therelative positions of the second member 22 and the terminal opticalelement 13 change.

In the present embodiment, the second member 22 can move substantiallyparallel to the XY plane. Meanwhile, the second member 22 may be able tomove in only one axial direction (for example, X-axis direction orY-axis direction). In addition, the second member 22 may be able to movein at least one direction of the Z-axis, θX, θY, and θZ, in addition tothe movement in the direction substantially parallel to the XY plane.

The second member 22 can move below at least a portion of the firstmember 21. In the present embodiment, the second member 22 can movebelow the third portion 213. In addition, the second member 22 can moveat the outside of at least a portion of the first member 21 with respectto the light path of the exposure light EL (optical axis of the terminaloptical element 13). In the present embodiment, the second member 22 canmove at the outsides of the first portion 211 and the second portion 212with respect to the light path of the exposure light EL (optical axis ofthe terminal optical element 13). When the second member 22 includes thefirst portion 211, and does not include the second portion 212, thesecond member 22 can move at the outside of the first portion 211 withrespect to the light path of the exposure light EL (optical axis of theterminal optical element 13). When the second member 22 includes thesecond portion 212, and does not include the first portion 211, thesecond member 22 can move at the outside of the second portion 212 withrespect to the light path of the exposure light EL (optical axis of theterminal optical element 13). In the present embodiment, the secondmember 22 is supported by the device frame 8B through the supporter 50.

At least a portion of the second member 22 is movably disposed betweenthe first member 21 and the substrate P (object) with respect to thedirection parallel to the optical axis of the terminal optical element13. The second member 22 can move between the first member 21 and thesubstrate P (object). In addition, in the present embodiment, the secondmember 22 can move concurrently with at least a portion of the movementof the substrate P (object). In addition, in the present embodiment, thesecond member 22 can move in a state where the liquid immersion space LSis formed. In addition, the second member 22 can move in a state wherethe liquid LQ is present in at least a portion of a space between thesecond member 22 and the substrate P (object). Meanwhile, the secondmember 22 can move in coordination with the movement of the substrate P(object), and can move independently of the substrate P (object).

Meanwhile, the second member 22 may move when the second member 22 andthe substrate P (object) do not face each other. In other words, thesecond member 22 may move when an object is not present below the secondmember 22. Meanwhile, the second member 22 may move when the liquid LQis not present in a space between the second member 22 and the substrateP (object). For example, the second member 22 may move when the liquidimmersion space LS is not formed.

In the present embodiment, the second member 22 is disposed in at leasta portion of the periphery of the terminal optical element 13. In thepresent embodiment, the second member 22 is disposed to maintain a gapwith respect to the first member 21. The second member 22 is disposed inat least a portion of the periphery of the first member 21 with a gaptherebetween. The second member 22 is disposed at the outside of thefirst member 21 with respect to the light path of the exposure light EL(optical axis of the terminal optical element 13), with a gap interposedtherebetween. In addition, the second member 22 is disposed below atleast a portion of the first member 21 with a gap therebetween.

In the present embodiment, the second member 22 is annular. In thepresent embodiment, the second member 22 includes an opening 26. Theopening 26 of the second member allows the exposure light EL to passtherethrough. In addition, in the present embodiment, the opening 26 ofthe second member 22 allows at least a portion of the first member 21 tobe disposed therein. In the present embodiment, the second member 22 isdisposed at the periphery of the second portion 212 below the thirdportion 213. The second member 22 is disposed so that a gap is formedbetween the second portion 212 and the third portion 213.

For example, as shown in FIG. 3, in the present embodiment, the secondmember 22 is annular. In the present embodiment, the opening 26 issubstantially circular.

In the present embodiment, the second member 22 includes an uppersurface 22A facing the lower surface 216 of the first member 21, and alower surface 22B facing in the opposite direction to that of the uppersurface 22A. The upper surface 22A is disposed at the periphery of theopening 26. The lower surface 22B can face the substrate P (object). Thelower surface 216 of the first member 21 and the upper surface 22A ofthe second member 22 face each other with a gap therebetween. Thesubstrate P (object) can face the lower surface 22B with a gaptherebetween. In the present embodiment, the second member 22 can movebelow the lower surface 216 of the first member 21 to interpose a gaptherebetween.

In the present embodiment, the movement of the second member 22 isguided by the lower surface 21G. In a state where the lower surface 21Gand the upper surface 21A face each other with a gap therebetween, thesecond member 22 moves along the lower surface 21G. In the followingdescription, the lower surface 21G of the first member 21 isappropriately referred to as a guide surface 21G, and the upper surface22A of the second member 22 is appropriately referred to as a movementsurface 22A. Meanwhile, the lower surface 216 of the first member 21 maynot have a function as a guide surface. The second member 22 may notinclude the third portion 213.

In the present embodiment, the second member 22 is disposed at theperiphery of the external surface 21D of the first member 21. The secondmember 22 moves in a space around the external surface 21D. The secondmember 22 moves in a space around the external surface 21D so as not tocome into contact with the first member 21. The second member 22 canmove in the periphery of the first member 21 (second member 212) with agap from the first member 21.

In the present embodiment, the guide surface 21G is disposed furtherupward than the lower surface 21B, in the periphery of the lower surface21B and the external surface 21D. The lower surface 22B of the secondmember 22 is disposed further upward than the lower surface 21B of thefirst member 21. Meanwhile, the lower surface 22B of the second member22 may be disposed further downward than the lower surface 21B of thefirst member 21. In addition, as mentioned above, when the first member21 is not provided with the second portion 212, the guide surface 21Gmay be disposed at the same plane as the lower surface 21B of the firstmember 21, or further downward than the lower surface 21B of the firstmember 21.

As shown in FIG. 3, the exposure apparatus EX includes a drive system 40that moves the second member 22. In the present embodiment, the drivesystem 40 can move the second member 22 within the XY plane. In theexample shown in FIG. 3, the drive system 40 includes a connectingmember 40C connected to the second member 22, a first actuator 41capable of moving the connecting member 40C in the Y-axis direction, anda second actuator 42 capable of moving the first actuator 41 in theX-axis direction. At least one of the first actuator 41 and the secondactuator 42 includes a motor or the like which is driven by, forexample, a Lorentz force. Meanwhile, the drive system 40 is not limitedto the configuration shown in FIG. 3. Meanwhile, the drive system 40 maybe configured to move the second member 22 in only one axial direction(for example, X-axis direction or Y-axis direction), and may beconfigured to move the second member 22 in at least one direction of theZ-axis, θX, θY, and θZ in addition to the movement in the directionsubstantially parallel to the XY plane.

The drive system 40 moves the second member 22 so that at least aportion of the guide surface 21G and at least a portion of the movementsurface 22A continue to face each other. In other words, the drivesystem 40 moves the second member 22 so that at least a portion of themovement surface 22A does not protrude to the outside of the guidesurface 21G. In addition, the drive system 40 moves the second member 22so that the first member 21 and the second member 22 do not come intocontact with each other.

In the present embodiment, the liquid LQ is not present between theguide surface 21G and the movement surface 22A. The infiltration of theliquid LQ between the guide surface 21G and the movement surface 22A issuppressed. The liquid immersion member 5 includes a suppression portion30 that suppresses the infiltration of the liquid LQ into a gap betweenthe guide surface 21G and the movement surface 22A. The suppressionportion 30 suppresses the infiltration of the liquid LQ into a space GSbetween the guide surface 21G and the movement surface 22A from a gapbetween the inner edge of the movement surface 22A of the second member22 defining the opening 26 and the guide surface 21G of the first member21. The suppression portion 30 includes a liquid-repellent film 31disposed on the guide surface 21G. In addition, the suppression portion30 includes the liquid-repellent film 31 disposed on the movementsurface 22A. Meanwhile, the film 31 may be disposed on both the guidesurface 21G and the movement surface 22A, and may be disposed on onlyone of them. The liquid LQ of the liquid immersion space LS is preventedfrom infiltrating into the gap between the guide surface 21G and themovement surface 22A by the film 31.

The contact angle of the film 31 with the liquid LQ is, for example, 90degrees or more. Meanwhile, the contact angle of the film 31 may be 100degrees or more, and may be 110 degrees or more. The film 31 may beformed of, for example, a material containing fluorine, and may beformed of a material containing silicon. The film 31 may contain, forexample, PEA (Tetra fluoro ethylene-perfluoro alkylvinyl ethercopolymer), may contain PTFE (Poly tetra fluoro ethylene), may containPEEK (polyetheretherketone), and may contain Teflon (registeredtrademark).

In addition, the suppression portion 30 includes a gas supply portion 32that supplies gas between the guide surface 21G and the movement surface22A. In the present embodiment, the gas supply portion 32 includes a gassupply port 33, disposed on the movement surface 22A, which supplies gasto the gap between the guide surface 21G and the movement surface 22A.Meanwhile, the gas supply port 33 may be disposed on the guide surface21G. Meanwhile, the gas supply port 33 may be disposed on both the guidesurface 21G and the movement surface 22A. The liquid LQ of the liquidimmersion space LS is prevented from infiltrating into the gap betweenthe guide surface 21G and the movement surface 22A by gas supplied fromthe gas supply port 33.

Meanwhile, the suppression portion 30 may include the film 31, and maynot include the gas supply portion 32. Meanwhile, the suppressionportion 30 may include the gas supply portion 32, and may not includethe film 31.

Meanwhile, as the suppression portion 30, a convex portion may beprovided in at least one of the periphery of the inner edge of themovement surface 22A of the second member 22 defining the opening 26 andthe guide surface 21G of the first member 21.

In the present embodiment, a gas bearing is formed between the guidesurface 21G and the movement surface 22A. The second member 22 ismovably supported by the first member 21 through the gas bearing in astate where the gap is formed between the guide surface 21G and themovement surface 22A.

In the present embodiment, the liquid immersion member 5 includes thegas supply port 33, and a discharge port 34, disposed on the movementsurface 22A, which discharges at least a portion of gas in the gapbetween the guide surface 21G and the movement surface 22A. A gasbearing is formed between the guide surface 21G and the movement surface22A by the supply of gas from the gas supply port 33 and the dischargeof gas from the discharge port 34. Meanwhile, the gas supply port 33 andthe discharge port 34 may be disposed on the guide surface 21G.

In the present embodiment, the liquid immersion member 5 includes a hole(opening) 35 that links the space GS between the guide surface 21G andthe movement surface 22A to the space (space formed by the chamberdevice 9) CS around the liquid immersion member 5. In the presentembodiment, the opening 35 is formed in the second member 22. Theopening 35 is disposed between the inner edge of the movement surface22A defining the opening 26 and the gas supply port 33 (discharge port34). The space GS is opened to the space CS (atmosphere) around theliquid immersion member 5 by the opening 35. When the space CS formed bythe chamber device 9 is the atmosphere (atmospheric pressure), theatmosphere of the space GS is released by the opening 35. Meanwhile, thespace CS formed by the chamber device 9 may not be the atmosphere(atmospheric pressure). Meanwhile, the opening 35 may not be present.

The second member 22 includes an internal surface 22C disposed at theperiphery of the external surface 21D of the first member 21. Theinternal surface 22C links the inner edge of the movement surface 22A tothe inner edge of the lower surface 22B. In the present embodiment, theinternal surface 22C is inclined downward toward the outside withrespect to the radiation direction for the optical axis (light path K)of the terminal optical element 13. Meanwhile, the internal surface 22Cmay be parallel to the optical axis of the terminal optical element 13(parallel to the Z-axis).

The supply port 23 is connected to a liquid supply device through asupply channel formed inside the first member 21. The supply port 23supplies the liquid LQ from the liquid supply device in order to formthe liquid immersion space LS. In the present embodiment, the supplyport 23 is disposed on the internal surface 21C so as to face a gapbetween the emission surface 12 and the upper surface 21A. Meanwhile,the supply port 23 may be disposed at the internal surface 21C so as toface a gap between the external surface 16 and the internal surface 21C.The liquid LQ supplied from the supply port 23 is supplied onto thesubstrate P (object) through the opening 21H.

In the present embodiment, the recovery port 24 of the second member 22is disposed so as to face the substrate P (object). In the presentembodiment, the second member 22 includes a porous member 25. In thepresent embodiment, the lower surface 22B of the second member 22includes a lower surface of the porous member 25. The recovery port 24includes a hole of the porous member 25. The porous member 25 includes,for example, a sintered body or a porous member. The recovery port 24(hole of the porous member 25) is connected to a liquid recovery device(not shown). The liquid recovery device can connect the recovery port 24and a vacuum system (not shown). The recovery port 24 can recover atleast a portion of the liquid LQ of the liquid immersion space LS. Theliquid LQ recovered from the recovery port 24 is recovered by the liquidrecovery device. Meanwhile, the internal surface 22C of the secondmember 22 may be provided with a recovery port capable of recovering theliquid LQ.

In the present embodiment, the operation of recovering the liquid LQfrom the recovery port 24 is performed concurrently with the operationof supplying the liquid LQ from the supply port 23, and thus the liquidimmersion space LS is formed by the liquid LQ between the terminaloptical element 13 and the liquid immersion member 5 on one side and thesubstrate P (object) on the other side.

In the present embodiment, a portion of an interface LG of the liquid LQof the liquid immersion space LS is formed between the second member 22and the substrate P (object). A portion of the lower surface 22B of thesecond member 22 and the internal surface 22C come into contact with theliquid LQ of the liquid immersion space LS.

In addition, in the present embodiment, a portion of the interface LG ofthe liquid LQ of the liquid immersion space LS is formed between theinner edge of the guide surface 21G of the first member 21 and the inneredge of the movement surface 22A of the second member 22. The guidesurface 21G and the movement surface 22A do not come into contact withthe liquid LQ of the liquid immersion space LS.

In addition, in the present embodiment, a portion of the interface LG ofthe liquid LQ of the liquid immersion space LS is formed between theinternal surface 21C of the first member 21 and the external surface 16of the terminal optical element 13.

Meanwhile, a portion of the interface LG of the liquid LQ of the liquidimmersion space LS may be formed between the substrate P (object) andthe first member 21 (for example, guide surface 21G).

In the following description, the interface LG of the liquid LQ formedbetween the second member 22 and the substrate P (object) isappropriately referred to as a first interface LG1, the interface LG ofthe liquid LQ formed between the first member 21 and the second member22 is appropriately referred to as a second interface LG2, and theinterface LG of the liquid LQ formed between the first member 21 and theterminal optical element 13 is appropriately referred to as a thirdinterface LG3.

FIGS. 5 and 6 are diagrams illustrating an example of an operation ofthe second member 22. The control device 6 moves the second member 22concurrently with at least a portion of the movement of the substrate P(object), for example, on the basis of movement conditions of thesubstrate P (object).

The second member 22 can recover the liquid LQ from the recovery port 24while moving. The control device 6 moves the second member 22concurrently with the recovery of the liquid LQ from the recovery port24. The control device 6 moves the second member 22 while not performingthe supply of the liquid LQ from the supply port 23 and the recovery ofthe liquid LQ from the recovery port 24 so that the liquid immersionspace LS continues to be formed.

As mentioned above, the second member 22 can move substantially parallelto the XY plane in a state where the liquid immersion space LS isformed. The second member 22 can move the first member 21 (third portion213) and the substrate P (object) while forming the liquid immersionspace LS. The second member 22 can move in a space around the firstmember 21 (second portion 212) in a state where the liquid immersionspace LS is formed.

In the present embodiment, the second member 22 moves so that therelative movement between the second member and the substrate P (object)decreases. In addition, the second member 22 moves so that the relativemovement between the second member and the substrate P (object)decreases more than the relative movement between the first member 21and the substrate P (object). For example, the second member 22 may movein synchronization with the substrate P (object). For example, thesecond member 22 may move so as to follow the substrate P (object).

The relative movement includes at least one of a relative velocity and arelative acceleration. For example, the second member 22 may move sothat the relative velocity between the second member and the substrate P(object) decreases while forming the liquid immersion space LS. Inaddition, the second member 22 may move so that the relativeacceleration between the second member and the substrate P (object)decreases in a state where the liquid immersion space LS is formed. Inaddition, the second member 22 may move so that the relative velocitybetween the second member and the substrate P (object) decreases morethan the relative velocity between the first member 21 and the substrateP (object) in a state where the liquid immersion space LS is formed. Inaddition, the second member 22 may move so that the relativeacceleration between the second member and the substrate P (object)decreases more than the relative acceleration between the first member21 and the substrate P (object) in a state where the liquid immersionspace LS is formed.

For example, as shown in FIG. 5, when the substrate P (object) moves inthe +Y-axis direction, the control device 6 moves the second member 22in the +Y-axis direction so that the relative velocity between thesecond member 22 and the substrate P (object) decreases. Meanwhile, thecontrol device 6 may move in at least one of the +X-axis direction andthe −X-axis direction while moving the second member 22 in the +Y-axisdirection so that the relative velocity between the second member 22 andthe substrate P (object) decreases. That is, when the substrate P(object) moves in the +Y-axis direction, the second member 22 may movein art arbitrary direction within the XY plane including a component ofthe +Y-axis direction so that the relative velocity between the secondmember and the substrate P (object) decreases.

In addition, as shown in FIG. 6, when the substrate P (object) moves inthe −Y-axis direction, the control device 6 moves the second member 22in the −Y-axis direction so that the relative velocity between thesecond member 22 and the substrate P (object) decreases. Meanwhile, thecontrol device 6 may move in at least one of the +X-axis direction andthe −X-axis direction while moving the second member 22 in the −Y-axisdirection so that the relative velocity between the second member 22 andthe substrate P (object) decreases. That is, when the substrate P(object) moves in the −Y-axis direction, the second member 22 may movein an arbitrary direction within the XY plane including a component ofthe −Y-axis direction so that the relative velocity between the secondmember and the substrate P (object) decreases.

Meanwhile, when the substrate P (object) moves in the +X-axis direction,the second member 22 may move in an arbitrary direction within the XYplane including a component of the +X-axis direction so that therelative velocity between the second member and the substrate P (object)decreases. In addition, when the substrate P (object) moves in the−X-axis direction, the second member 22 may move in an arbitrarydirection within the XY plane including a component of the −X-axisdirection so that the relative velocity between the second member andthe substrate P (object) decreases.

Next, a method of exposing the substrate P using the exposure apparatusEX having the above-mentioned configuration will be described.

In a substrate replacement position separated from the liquid immersionmember 5, a process of loading the substrate P before exposure onto thesubstrate stage 2 (first holding portion) is performed. In addition, inat least a portion of the period in which the substrate stage 2 isseparated from the liquid immersion member 5, the measurement stage 3 isdisposed so as to face the terminal optical element 13 and the liquidimmersion member 5. The control device 6 performs the supply of theliquid LQ from the supply port 23 and the recovery of the liquid LQ fromthe recovery port 24, and forms the liquid immersion space LS on themeasurement stage 3.

After the substrate P before exposure is loaded onto the substrate stage2, and the measurement process using the measurement stage 3 isterminated, the control device 6 move the substrate stage 2 so that theterminal optical element 13 and the liquid immersion member 5 and thesubstrate stage 2 (substrate P) face each other. In a state where theterminal optical element 13 and the liquid immersion member 5 and thesubstrate stage 2 (substrate P) face each other, the recovery of theliquid LQ from the recovery port 24 is performed concurrently with thesupply of the liquid LQ from the supply port 23, and thus the liquidimmersion space LS is formed between the terminal optical element 13 andthe liquid immersion member 5 and the substrate stage 2 (substrate P) sothat the light path K is filled with the liquid LQ.

The control device 6 starts an exposure process of the substrate P. Thecontrol device 6 emits the exposure light EL from the illuminationsystem IL in a state where the liquid immersion space LS is formed onthe substrate P. The illumination system IL illuminates the mask M withthe exposure light EL. The substrate P is irradiated with the exposurelight EL from the mask M through the liquid LQ of the liquid immersionspace LS between the projection optical system PL and the emissionsurface 12 and the substrate P. Thereby, the substrate P is exposed withthe exposure light EL emitted from the emission surface 12 through theliquid LQ of the liquid immersion space LS, and an image of a pattern ofthe mask M is projected onto the substrate P.

The exposure apparatus EX of the present embodiment is a scanning-typeexposure apparatus (so-called scanning stepper) that projects the imageof the pattern of the mask M onto the substrate P while synchronouslymoving the mask M and the substrate P in a predetermined scanningdirection. In the present embodiment, the scanning direction(synchronous movement direction) of the substrate P is set to a Y axialdirection, and the scanning direction (synchronous movement direction)of the mask M is also set to a Y axial direction. The control apparatus6 irradiates the substrate P with the exposure light EL through theprojection optical system PL and the liquid LQ of the liquid immersionspace LS on the substrate P, while moving the substrate P in the Y axialdirection with respect to the projection region PR of the projectionoptical system PL, and moving the mask M in the Y axial direction withrespect to the illumination region IR of the illumination system IL insynchronization with the movement of the substrate P in the Y axialdirection.

FIG. 7 is a diagram illustrating an example of the substrate P held bythe substrate stage 2. In the present embodiment, a plurality of shotregions S which are regions to be exposed are disposed at the substrateP in a matrix. The control device 6 sequentially exposes the pluralityof shot regions S of the substrate P held by the first holding portionwith the exposure light EL through the liquid LQ of the liquid immersionspace LS.

For example, in order to expose a first shot region S of the substrateP, the control device 6 moves the substrate P (first shot region S) inthe Y-axis direction with respect to the projection region PR of theprojection optical system PL in a state where the liquid immersion spaceLS is formed, and irradiates the first shot region S with the exposurelight EL through the projection optical system PL and the liquid LQ ofthe liquid immersion space LS on the substrate P while moving the mask Min the Y-axis direction with respect to the illumination region IR ofthe illumination system IL, in synchronization with the movement of thesubstrate P in the Y-axis direction. Thereby, the image of the patternof the mask M is projected onto the first shot region S of the substrateP, and the first shot region S is exposed with the exposure light ELemitted from the emission surface 12. After the exposure of the firstshot region S is terminated, the control device 6 moves the substrate Pin the direction (for example, X-axis direction, direction inclined withrespect to the X-axis and the Y-axis directions within the XY plane, orthe like) intersecting the X-axis within the XY plane, in order to startto the exposure of the next second shot region S, in a state where theliquid immersion space LS is formed, and moves the second shot region Sto an exposure start position. Thereafter, the control device 6 startsthe exposure of the second shot region S.

The control device 6 sequentially exposes a plurality of shot regions ofthe substrate P while repeating an operation of exposing a shot regionduring the movement of the shot region in the Y-axis direction withrespect to a position (projection region PR) irradiated with theexposure light EL from the emission surface 12 in a state where theliquid immersion space LS is formed on the substrate P (substrate stage2), and operation of moving the substrate P in the direction (forexample, X-axis direction, direction inclined with respect to the X-axisand Y-axis directions within the XY plane, or the like) intersecting theY-axis direction within the XY plane so that the next shot region isdisposed at an exposure start position in a state where the liquidimmersion space LS is formed on the substrate P (substrate stage 2)after the exposure of the shot region.

In the following description, in a state where the liquid immersionspace LS is formed on the substrate P (substrate stage 2) in order toexpose the shot region, the operation of moving the substrate P (shotregion) in the Y-axis direction with respect to the position (projectionregion PR) irradiated with the exposure light EL from the emissionsurface 12 is appropriately referred to as a scanning movementoperation. In addition, until the exposure of the next shot region isstarted in a state where the exposure of a certain shot region iscompleted and then the liquid immersion space LS is formed on thesubstrate P (substrate stage 2), the operation of moving the substrate Pwithin the XY plane is appropriately referred to as a step movementoperation. The control device 6 sequentially exposes a plurality of shotregions S of the substrate P while repeating the scanning movementoperation and the step movement operation. Meanwhile, the scanningmovement operation is constant velocity movement wholly with respect tothe Y-axis direction. The step movement operation includes accelerationand deceleration movement. For example, the step movement operationbetween two shot regions adjacent to the X-axis direction includesacceleration and deceleration movement with respect to the Y-axisdirection, and acceleration and deceleration movement with respect tothe X-axis direction.

Meanwhile, in at least a portion of the scanning movement operation andthe step movement operation, at least a portion of the liquid immersionspace LS may be formed on the substrate stage 2 (cover member T).

The control device 6 controls the drive system 15 on the basis of theexposure conditions of a plurality of shot regions S on the substrate P,and moves the substrate P (substrate stage 2). The exposure conditionsof the plurality of shot regions S are defined by, for example, exposurecontrol information called an exposure recipe. The exposure controlinformation is stored in the storage device 7. The control device 6sequentially exposes the plurality of shot regions S while moving thesubstrate P under predetermined movement conditions on the basis of theexposure conditions stored in the storage device 7. The movementconditions of the substrate P (object) include at least one of themovement velocity, the acceleration, the movement distance, the movementdirection, and the movement locus within the XY plane.

The control device 6 irradiates the projection region PR with theexposure light EL while moving the substrate stage 2 so that theprojection region PR of the projection optical system PL and thesubstrate P relatively along the movement locus as, for example, shownby arrow Sr of FIG. 7, and sequentially exposes the plurality of shotregions S of the substrate P with the exposure light EL through theliquid LQ.

Hereinafter, the above-mentioned processes are repeated, and a pluralityof substrates P are sequentially exposed.

In the present embodiment, the second member 22 moves in at least aportion of the exposure process of the substrate P. The second member 22moves so that the relative movement (relative velocity or relativeacceleration) between the second member and the substrate P (substratestage 2) decreases when the scanning movement operation and the stepmovement operation are performed on the substrate P (substrate stage 2)in a state where the liquid immersion space LS is formed.

FIG. 8(A) is a diagram schematically illustrating an example of themovement locus of the substrate P when a shot region Sa and a shotregion Sb are sequentially exposed, and FIG. 8(B) is a diagramschematically illustrating an example of the movement locus of thesecond member 22 when the shot region Sa and the shot region Sb aresequentially exposed.

As shown in FIG. 8(A), when the shot region Sa is exposed, under theterminal optical element 13, the substrate P sequentially moves on apath Tp1 from a position d1 to a position d2 adjacent to the −Y-axisside with respect to the position d1, a path Tp2 from the position d2 toa position d3 adjacent to the −X-axis side with respect to the positiond2, a path Tp3 from a position d3 to a position d4 adjacent to the+Y-axis side with respect to the position d3, and a path Tp4 from aposition d4 to a position d5 adjacent to the −X-axis side with respectto the position d4. The positions d1, d2, d3, and d4 are positionswithin the XY plane.

At least a portion of the path Tp1 is a straight line parallel to theY-axis. At least a portion of the path Tp3 is a straight line parallelto the Y-axis. The path Tp2 includes a curved line. The path Tp4includes a curved line. The position d1 includes a starting point of thepath Tp1, and the position d2 includes an end point of the path Tp1. Theposition d2 includes a starting point of the path Tp2, and the positiond3 includes of an end point of the path Tp2. The position d3 includes astarting point of the path Tp3, and the position d4 includes an endpoint of the path Tp3. The position d4 includes a starting point of thepath Tp4, and the position d5 includes an end point of the path Tp4. Thepath Tp1 is a path on which the substrate P moves in the −Y-axisdirection. The path Tp3 is a path on which the substrate P moves in the+Y-axis direction. The path Tp2 and the path Tp4 are paths in which thesubstrate P moves in a direction based on the −X-axis direction.

When the substrate P moves on the path Tp1 in a state where the liquidimmersion space LS is formed, the shot region Sa is irradiated with theexposure light EL through the liquid LQ. The operation of the substrateP moving on the path Tp1 includes the scanning movement operation. Inaddition, when the substrate P moves on the path Tp3 in a state wherethe liquid immersion space LS is formed, the shot region Sb isirradiated with the exposure light EL through the liquid LQ. Theoperation of the substrate P moving on the path Tp3 includes thescanning movement operation. In addition, the operation of the substrateP moving on the path Tp2 and the operation of the substrate moving onthe path Tp4 include the step movement operation.

When the substrate P sequentially moves on the paths Tp1, Tp3, and Tp4,the second member 22 sequentially moves on the paths Tn1, Tn2, Tn3, andTn4 as shown in FIG. 8(B). The path Tn1 is a path from a position e1 toa position e2. The path Tn2 is a path from the position e2 to a positione3. The path Tn3 is a path from the position e3 to a position e4. Thepath Tn4 is a path from the position e4 to the position e1. The path Tn1includes a straight line. The path Tn2 includes a curved line. The pathTn3 includes a straight line. The path Tn4 includes a curved line. Thepath Tn1 and the path Tn3 intersect each other. The path Tn1 and thepath Tn3 are inclined with respect to both the X-axis and the Y-axis.The path Tn1 is a path in which the second member 22 moves in the−Y-axis direction while moving in the +X-axis direction. The path Tn2 isa path in which the second member 22 moves in a direction based on the−X-axis direction. The path Tn3 is a path in which the second member 22moves in the +Y-axis direction while moving in the +X-axis direction.The path Tn4 is a path in which the second member 22 moves in adirection based on the −X-axis direction.

That is, in the present embodiment, the second member 22 moves withinthe XY plane so as to draw the Arabic numeral “8”.

FIGS. 9 and 10 are diagrams illustrating an example in a state where thesecond member 22 moves so as to draw a numeral “8”. FIGS. 9 and 10 arediagrams when the second member 22 is viewed upward from the substrate P(object) side. The second member 22 can move so as to change to a stateshown in FIG. 10(D) from a state shown in FIG. 9(A) sequentially throughstates shown in FIG. 9(B), FIG. 9(C), FIG. 9(D), FIG. 10(A), FIG. 10(B),and FIG. 10(C).

FIGS. 11 and 12 are diagrams illustrating an example of a relationshipbetween the movement velocity of the substrate P (substrate stage 2)when a plurality of adjacent shot regions parallel to the X-axis aresequentially exposed by the scanning movement operation and the stepmovement operation during step movement in the +X-axis direction and themovement velocity of the second member 22 moving so as to draw thenumeral “8” according to the movement of the substrate P.

FIG. 11(A) shows the movement velocities of the substrate P (substratestage 2) and the second member 2 with respect to the X-axis direction.FIG. 11(B) shows the movement velocities of the substrate P (substratestage 2) and the second member 22 with respect to the Y-axis direction.Line Vxp of FIG. 11(A) shows the movement velocity of the substrate P(substrate stage 2) with respect to the X-axis direction, and line Vxnshows the movement velocity of the second member 22 with respect to theX-axis direction. In addition, line Vyp of FIG. 11(B) shows the movementvelocity of the substrate P (substrate stage 2) with respect to theY-axis direction, and line Vyn shows the movement velocity of the secondmember 22 with respect to the Y-axis direction.

In addition, a period Ta of FIG. 11 shows a period in which the scanningmovement operation is performed on the substrate P (substrate stage 2).A period Tb shows a period in which the step movement operation isperformed on the substrate P (substrate stage 2). As shown in FIG. 11,in at least a portion of the period Ta of the scanning movementoperation of the substrate P (substrate stage 2), the second member 22moves in the same scanning direction (Y-axis direction) as that of thesubstrate P (substrate stage 2), and moves in the opposite direction(−X-axis direction) to the step direction (+X-axis direction) of thesubstrate P (substrate stage 2). In addition, in at least a portion ofthe period Tb of the step movement operation of the substrate P(substrate stage 2), the second member 22 moves in the same scanningdirection (Y-axis direction) as that of the substrate P (substrate stage2), and moves in the same direction (+X-axis direction) as the stepdirection (+X-axis direction) of the substrate P (substrate stage 2).

FIG. 12(A) shows the relative velocity between the substrate P(substrate stage 2) and the second member 22 with respect to the X-axisdirection. FIG. 12(B) shows the relative velocity between the substrateP (substrate stage 2) and the second member 22 with respect to theY-axis direction. Line ΔVx of FIG. 12(A) shows the relative velocitybetween the substrate P (substrate stage 2) and the second member 22with respect to the X-axis direction. Line ΔVy of FIG. 12(B) shows therelative velocity between the substrate P (substrate stage 2) and thesecond member 22 with respect to the Y-axis direction. Meanwhile, themovement velocity Vxp of the substrate P (substrate stage 2) withrespect to the X-axis direction is also shown in FIG. 12(A), and themovement velocity Vyp of the substrate P (substrate stage 2) withrespect to the Y-axis direction is also shown in FIG. 12(B).

As shown in FIG. 12, when the scanning movement operation and the stepmovement operation are performed on the substrate P (substrate stage 2),the second member 22 moves so as to draw the numeral “8”, and thus therelative velocity (ΔVx, ΔVy) between the substrate P (substrate stage 2)and the second member 22 can be made to be lower than the movementvelocity (Vxp, Vyp) of at least the substrate P (substrate stage 2). Inaddition, the relative velocity (ΔVx, ΔVy) between the substrate P(substrate stage 2) and the second member 22 can be made to be lowerthan at least the relative velocity between (Vxp, Vyp) the substrate P(substrate stage 2) and the first member 21.

Meanwhile, in the period Ta of FIG. 11, the velocity (absolute value)when the second member 22 moves at the constant velocity in the scanningdirection is lower than the velocity (absolute value) when the substrateP (substrate stage 2) moves at a constant velocity in the scanningdirection, but may be the same. In addition, in the period Ta of FIG.11, a period where the second member 22 moves at the constant velocityin the scanning direction may be absent. Meanwhile, in the period Tb ofFIG. 11, the maximum velocity (absolute value) when the second member 22moves in the step direction is lower than the maximum velocity (absolutevalue) when the substrate P (substrate stage 2) moves in the stepdirection, but may be the same. In addition, in the period Tb of FIG.11, the velocity (absolute value) when the second member 22 moves in thescanning direction is lower than the velocity (absolute value) when thesubstrate P (substrate stage 2) moves in the scanning direction, but maybe the same. In addition, the maximum velocity (absolute value) when thesecond member 22 moves in the step direction in the period Ta may be thesame as the maximum velocity (absolute value) when the second member 22moves in the step direction in the period Tb, and may be different. Forexample, the maximum velocity (absolute value) when the second member 22moves in the step direction in the period Ta may be made to be higherthan the maximum velocity (absolute value) when the second member 22moves in the step direction in the period Tb.

As described above, according to the present embodiment, the secondmember 22 having the recovery port 24 movable below the first member 21is provided. Therefore, even when an object such as the substrate Pmoves within the XY plane in a state where the liquid immersion space LSis formed, for example, the outflow of the liquid LQ from a spacebetween the liquid immersion member 5 and the object or the remaining ofthe liquid on the object is suppressed. In addition, the generation ofbubbles (gas) in the liquid LQ of the liquid immersion space LS is alsosuppressed.

In addition, the second member 22 is moved so that the relative movement(relative velocity, relative acceleration) between the second member andthe object decreases, thereby allowing the outflow of the liquid LQ, theremaining of the liquid LQ, or the generation of bubbles in the liquidLQ to be suppressed even when the object moves at a high speed in astate where the liquid immersion space LS is formed.

Therefore, it is possible to suppress the generation of a defectiveexposure and the generation of a defective device.

In addition, in the present embodiment, the first member 21 is disposedin at least a portion of the periphery of the terminal optical element13. Therefore, even when the object moves or the second member 22 movesin a state where the liquid immersion space LS is formed, fluctuation inpressure between the terminal optical element 13 and the first member 21or great fluctuation in the shape of the third interface LG3 of theliquid LQ between the first member 21 and the terminal optical element13 is suppressed. Therefore, for example, the generation of bubbles inthe liquid LQ or the action of an excessive force on the terminaloptical element 13 is suppressed. In addition, in the presentembodiment, since the first member 21 does not substantially move, greatfluctuation in pressure between the terminal optical element 13 and thefirst member 21 or great fluctuation in the shape of the third interfaceLG3 of the liquid LQ between the terminal optical element 13 and thefirst member 21 is suppressed.

Meanwhile, the first member 21 may be able to move. The first member 21may move in at least one direction of six directions of the X-axis,Y-axis, Z-axis, θX, θY, and θZ. For example, in order to adjust apositional relationship between the terminal optical element 13 and thefirst member 21, or adjust a positional relationship between the firstmember 21 and the second member 22, the first member 21 may be moved. Inaddition, the first member 21 may be moved concurrently with at least aportion of the movement of the substrate P (object). For example, thefirst member may be moved a shorter distance than the second member 22within the XY plane. In addition, the first member 21 may be moved at alower speed than the second member 22. In addition, the first member 21may be moved at a lower acceleration that the second member 22.

In addition, in the present embodiment, since the liquid LQ is notpresent between the guide surface 21G of the first member 21 and themovement surface 22A of the second member 22, the second member 22 canmove smoothly.

Meanwhile, the liquid LQ may be present between the guide surface 210and the movement surface 22A. In addition, the suppression portion 30may be omitted.

Meanwhile, in the present embodiment, a gas bearing may not be formedbetween the first member 21 and the second member 22. Meanwhile, in thepresent embodiment, the first member 21 may not include the thirdportion 213. In this case, the first member 21 may not be disposed abovethe second member 22. That is, the second member 22 may not move belowthe first member 21. Meanwhile, in the present embodiment, the firstmember 21 and the second member 22 are supported by the device frame 8B,but the first member 21 may be supported by a frame other than thedevice frame 8B. For example, the first member 21 may be supported bythe basic frame 8A.

In addition, in the present embodiment, the internal surface 22C of thesecond member 22 is inclined downward toward the outside with respect tothe radiation direction for the light path K. Therefore, even when theinternal surface 22C moves in a state where it comes into contact withthe liquid LQ of the liquid immersion space LS, great fluctuations inthe pressure inside the liquid immersion space LS and generation of aflow which is not desirable in the liquid LQ of the liquid immersionspace LS are suppressed.

Meanwhile, in the example shown in FIG. 8 or the like, when the shotregion Sa is exposed and then the shot region Sb disposed at the X-axisdirection with respect to the shot region Sa is exposed, the secondmember 22 is moved. However, for example, as shown in FIG. 13(A), when ashot region Sc, a shot region Sd, and a shot region Se which aredisposed at the Y-axis direction are sequentially exposed and then ashot region Sf, a shot region Sg, and a shot region Sh which aredisposed at the X-axis direction with respect to the shot regions Se,Sd, and Sc are sequentially exposed, the second member 22 may be movedas shown in FIG. 13(B). In an example shown in FIG. 13, the secondmember 22 may also be moved so as to draw, for example, the Arabicnumeral “8”.

Meanwhile, in the above-mentioned embodiment, when the scanning movementoperation and the step movement operation are performed on the substrateP, the second member 22 may not draw the Arabic numeral “8”. Forexample, when the second member 22 is set to be moved in only the Y-axisdirection, and the scanning movement operation is performed on thesubstrate P (substrate stage 2), the second member may be just moved inthe same Y-axis direction as that of the substrate P.

Meanwhile, in the above-mentioned embodiment, the second member 22 movesso that the guide surface 21G and the movement surface 22A continue toface each other, but the second member 22 may move so that at least aportion of the movement surface 22A protrudes to the outside of theguide surface 21G. Meanwhile, the second member 22 may move so as tocome into contact with at least a portion of the first member 21.

Meanwhile, in the above-mentioned embodiment, in a state where theliquid immersion space LS is formed, the second member 22 may move sothat the movement distance in the X-axis direction increases more thanthe movement distance in the Y-axis direction, and may move so that themovement distance in the Y-axis direction increases more than themovement distance in the X-axis direction. In addition, the secondmember 22 may travel a distance longer or shorter than or equal to thesize of the opening 21H with respect to the X-axis direction. Inaddition, the second member 22 may travel a distance longer or shorterthan or equal to the size of the shot region S. In addition, the secondmember 22 may travel a distance longer or shorter than or equal to thesize of the lower surface 21B.

Second Embodiment

A second embodiment will be described. In the following description, thesame reference signs and numerals are given to the same components asthose of the above-mentioned embodiment, and a description thereof willbe simplified or omitted here.

FIG. 14 is a diagram illustrating an example of a second member 222according to the present embodiment. As shown in FIG. 14, an externalsurface 22D of the second member 222 may be inclined upward toward theoutside with respect to the radiation direction of the light path K.Thereby, for example, even when the first interface LG1 moves to theoutside of the lower surface 22B, the outflow of the liquid LQ issuppressed by the inclined external surface 22D. For example, in FIG.14, when the substrate P (object) moves in the −Y-axis direction, thereis a possibility of the first interface LG1 moving in the −Y-axisdirection. The inclined external surface 22D is provided, therebyallowing the movement of the first interface LG1 in the −Y-axisdirection between the external surface 22D and the upper surface of thesubstrate P (object) to be suppressed.

In addition, even when the second member 222 moves, the outflow of theliquid LQ is suppressed by the inclined external surface 22D.

Meanwhile, in the present embodiment, a gas bearing may not be provided,and the first member 21 may not include the third portion 213. The sameis true of the following embodiment.

Third Embodiment

A third embodiment will be described. In the following description, thesame reference signs and numerals are given to the same components asthose of the above-mentioned embodiment, and description thereof will besimplified or omitted here.

FIG. 15 is a diagram illustrating an example of a second member 223according to the third embodiment. In the present embodiment, the secondmember 223 includes a mesh plate 253 and a base member 254 that supportsthe mesh plate 253. A space 223S is formed between the mesh plate 253and the base member 254. The mesh plate 253 includes a lower surface253B capable of facing the substrate P (object), an upper surface 253Afacing the space 223S, and a plurality of holes (openings) formed so asto link the upper surface 253A to the lower surface 253B. The recoveryport 24 includes a hole (opening) of the mesh plate 253. At least aportion of the liquid LQ that comes into contact with the lower surface253B can flow into the space 223S through the recovery port 24.

In an example shown in FIG. 15, the space 223S and a liquid recoverydevice (not shown) are connected to each other. The liquid recoverydevice includes a vacuum system (not shown). In the present embodiment,only the liquid LQ between the mesh plate 253 and the object isrecovered through the recovery port 24, and the difference betweenpressure on the upper surface 253A side and pressure on the lowersurface 253B side is adjusted so that gas is not recovered. Meanwhile,an example of a technique in which only the liquid is substantiallyrecovered through a porous member and the recovery of gas is restrictedis disclosed in, for example, Specification of U.S. Pat. No. 7,292,313and the like.

In the present embodiment, the second member 223 can also recover theliquid LQ while moving. In the present embodiment, the generation of adefective exposure is also suppressed by moving the second member 223.

Fourth Embodiment

A fourth embodiment will be described. In the following description, thesame reference signs and numerals are given to the same components asthose of the above-mentioned embodiment, and a description thereof willbe simplified or omitted here.

FIG. 16 is a diagram illustrating an example of a second member 224according to the present embodiment. The second member 224 includes anopening 264 in which at least a portion of the first member 21 isdisposed. The sizes of the opening 264 with respect to the X-axisdirection and the opening 264 with respect to the Y-axis direction aredifferent from each other. In an example shown in FIG. 16, the size ofthe opening 264 with respect to the X-axis direction is smaller than thesize of the opening 264 with respect to the Y-axis direction. Meanwhile,the size of the opening 264 with respect to the X-axis direction may belarger than the size of the opening 264 with respect to the Y-axisdirection. In the example shown in FIG. 16, the shape of the opening 264of the second member 224 is elliptical.

Meanwhile, in the examples shown in FIG. 3, FIG. 16 and the like, theopenings (26 and the like) of the second members (22 and the like) donot include a corner, but may include a corner. For example, theopenings (26 and the like) of the second members (22 and the like) maybe in the shape of a polygon, such as a triangle, a pentagon, a hexagon,a heptagon, or an octagon.

In addition, in the examples shown in FIG. 3, FIG. 16 and the like, theopenings (26 and the like) of the second members (22 and the like) andthe outer shape of the second member 22 have similar shapes(resemblance), but may not have the same shape.

Fifth Embodiment

A fifth embodiment will be described. In the following description, thesame reference signs and numerals are given to the same components asthose of the above-mentioned embodiment, and a description thereof willbe simplified or omitted here.

FIG. 17 is a diagram illustrating an example of a second member 225according to the present embodiment. As shown in FIG. 17, the outershape of the second member 225 within the XY plane is substantially aquadrigon. An opening 265 of the second member 225 is in the shape of acircle. Meanwhile, the opening 265 may be in the shape of, for example,a polygon such as quadrigon, a hexagon, and an octagon, or may beelliptical.

In the present embodiment, the second member 225 does not include aporous member. In FIG. 17, a plurality of recovery ports 24 are disposedso as to surround the light path K in the lower surface of the secondmember 225. The recovery ports 24 can recover the liquid LQ and gas allat once. The first interface LG1 of the liquid LQ of the liquidimmersion space LS is disposed at the recovery port 24.

In the present embodiment, the generation of a defective exposure isalso suppressed by moving the second member 225.

Meanwhile, in the above-mentioned embodiment, the second member (22 andthe like) is an annular member surrounding the optical axis of theterminal optical element 13; alternatively, a plurality of secondmembers may be disposed at the periphery of the optical axis. Inaddition, the plurality of second members may move independently of eachother. In addition, among the plurality of second members, some secondmembers may move, and some second members may not move.

Meanwhile, in the above-mentioned embodiment, the control device 6includes a computer system having a CPU and the like. In addition, thecontrol device 6 includes an interface capable of executingcommunication with a computer system and an external apparatus. Thestorage device 7 includes, for example, a memory such as a RAM, a harddisk, and a recording medium such as CD-ROM. An operating system (OS)that controls a computer system is installed on the storage device 7,and a program for controlling the exposure apparatus EX is storedtherein.

Meanwhile, an input device capable of inputting an input signal may beconnected to the control device 6. The input device includes inputdevices such as a keyboard and a mouse, communication devices capable ofinputting data from an external apparatus, and the like. In addition, adisplay device such as a liquid crystal display may be provided.

Various types of information including a program recorded in the storagedevice 7 can be read by the control device (computer system) 6. Aprogram causing the control device 6 to execute the control of theliquid immersion exposure apparatus that exposes a substrate withexposure light through first liquid filled in a light path of exposurelight between the substrate and an emission surface of an optical memberfrom which the exposure light is emitted is recorded in the storagedevice 7.

According to the above-mentioned embodiment, the program recorded in thestorage device 7 may cause the control device 6 to execute forming aliquid immersion space so that a light path of exposure light emittedfrom an emission surface of an optical member is filled with liquid,exposing a substrate with the exposure light emitted from the emissionsurface through the liquid in the liquid immersion space, and moving asecond member, disposed below a first member to maintain a gap withrespect to the first member disposed in at least a portion of theperiphery of an optical member, which includes a recovery port thatrecovers at least a portion of the liquid in the liquid immersion space.

The program stored in the storage device 7 is read by the control device6, and thus various types of apparatuses of the exposure apparatus EXsuch as the substrate stage 2, the measurement stage 3, and the liquidimmersion member 5 execute various types of processes such as a liquidimmersion exposure of the substrate P in cooperation with each other ina state where the liquid immersion space LS is formed.

Meanwhile, in each of the above-mentioned embodiments, although thelight path K on the emission surface 12 side (image plane side) of theterminal optical element 13 of the projection optical system PL isfilled with the liquid LQ, the projection optical system PL may be aprojection optical system in which the light path on the incident side(object plane side) of the terminal optical element 13 is also filledwith the liquid LQ, for example, as disclosed in Pamphlet ofInternational Publication No. 2004/019128.

Meanwhile, in each of the above-mentioned embodiments, although water isused as the liquid LQ, a liquid other than water may be used. It ispreferable that the liquid LQ be able to transmit the exposure light EL,have a high refractive index with respect to the exposure light EL, andbe stable with respect to a film such as a photosensitive material(photoresist) from which the projection optical system PL or the surfaceof the substrate P is formed. For example, the liquid LQ may be afluorine-based liquid such as hydrofluoroether (HFE), perfluorinatedpolyether (PFPE), or Fomblin oil. In addition, the liquid LQ may bevarious fluids, such as, for example, a supercritical fluid.

Meanwhile, in each of the above-mentioned embodiments, the substrate Pincludes a semiconductor wafer for fabricating a semiconductor device,but may include, for example, a glass substrate for a display device, aceramic wafer for a thin-film magnetic head, an original plate(synthetic silica, silicon wafer) of a mask or a reticle used in anexposure apparatus, or the like.

Meanwhile, in each of the above-mentioned embodiments, the exposureapparatus EX is a step-and-scan type scanning exposure apparatus(scanning stepper) that scans and exposes the pattern of the mask M bysynchronously moving the mask M and the substrate P, but may be, forexample, a step-and-repeat type projection exposure apparatus (stepper)in which sequential step movement is performed on the substrate P bycollectively exposing the pattern of the mask M in a state where themask M and the substrate P are stopped.

In addition, in the step-and-repeat type exposure, the exposureapparatus EX may be an exposure apparatus (stitch-type collectiveexposure apparatus) in which a reduced image of the first pattern istransferred onto the substrate P using the projection optical system ina state where the first pattern and the substrate P are substantiallystopped, and then the reduced image of the second pattern is partiallyoverlapped with the first pattern using the projection optical systemand is collectively exposed on the substrate P in a state where thesecond pattern and the substrate P are substantially stopped. Inaddition, the stitch-type exposure apparatus may be a step-and-stitchtype exposure apparatus in which at least two patterns are partiallyoverlapped with each other on the substrate P and are transferred, andthe substrate P is sequentially moved.

In addition, for example, as disclosed in Specification of U.S. Pat. No.6,611,316, the exposure apparatus EX may be an exposure apparatus inwhich the patterns of two masks are synthesized on the substrate throughthe projection optical system, and one shot region on the substrate isdouble-exposed almost simultaneously by one-time scanning exposure. Inaddition, the exposure apparatus EX may be a proximity-type exposureapparatus, a mirror projection aligner, or the like.

In addition, in each of the above-mentioned embodiments, the exposureapparatus EX may be a twin stage type exposure apparatus including aplurality of substrate stages as disclosed in the specification of U.S.Pat. No. 6,341,007, the specification of U.S. Pat. No. 6,208,407, thespecification of U.S. Pat. No. 6,262,796, and the like. For example, asshown in FIG. 18, when the exposure apparatus EX includes two substratestages 2001 and 2002, the object capable of being disposed so as to facethe emission surface 12 includes at least one of a first substratestage, a substrate held by a first holding portion of the firstsubstrate stage, a second substrate stage, and a substrate held by thefirst holding portion of the second substrate stage.

In addition, the exposure apparatus EX may be an exposure apparatusincluding a plurality of substrate stages and measurement stages.

The exposure apparatus EX may be an exposure apparatus for fabricating asemiconductor device that exposes a pattern of a semiconductor device onthe substrate P, may be an exposure apparatus for fabricating a liquidcrystal device or fabricating a display, and may be an exposureapparatus for fabricating a thin-film magnetic head, an image capturingdevice (CCD), a micro-machine, a MEMS, a DNA chip, a reticle, a mask, orthe like.

Meanwhile, in the above-mentioned embodiments, an optically transmissivemask wherein a prescribed shielding pattern (or phase pattern or dimmingpattern) formed on an optically transmissive substrate, is used;however, instead of such a mask, a variable shaped mask (also called anelectronic mask, an active mask, or an image generator), in which atransmissive pattern, a reflective pattern, or a light emitting patternbased on electronic data of the pattern to be exposed is formed, asdisclosed in, for example, the specification of U.S. Pat. No. 6,778,257,may be used. In addition, instead of a variable shaped mask thatincludes a non-emissive type image display device, a pattern formingapparatus that includes a self-luminous type image display device may beprovided.

In each of the above-mentioned embodiments, the exposure apparatus EXincludes the projection optical system PL, but the components describedin each of the above-mentioned embodiments may be applied to an exposureapparatus and an exposure method in which the projection optical systemPL is not used. For example, the components described in each of theabove-mentioned embodiments may be applied to an exposure apparatus andan exposure method in which a liquid immersion space is form between anoptical member such as a lens and a substrate, and the substrate isirradiated with exposure light through the optical member.

In addition, the exposure apparatus EX may be an exposure apparatus(lithographic system) that exposes a line-and-space pattern on thesubstrate P by forming interference fringes on the substrate P as, forexample, disclosed in Pamphlet of International Publication No.2001/035168.

The exposure apparatus EX according to the above-mentioned embodimentsis manufactured by assembling various subsystems, including each of thecomponents mentioned above, so that predetermined mechanical,electrical, and optical accuracies are maintained. To ensure thesevarious accuracies, adjustments are performed before and after thisassembly, including an adjustment to achieve optical accuracy for thevarious optical systems, an adjustment to achieve the mechanicalaccuracy for the various mechanical systems, and an adjust cut toachieve the electrical accuracy for the various electrical systems. Theprocess of assembling the exposure apparatus from the various subsystemsincludes, for example, the connection of mechanical components, thewiring and connection of electrical circuits, and the piping andconnection of the pneumatic circuits among the various subsystems.Naturally, prior to performing the process of assembling the exposureapparatus from these various subsystems, there are also processes ofassembling each individual subsystem. When the process of assembling theexposure apparatus from the various subsystems is complete, acomprehensive adjustment is performed to ensure the various accuraciesof the exposure apparatus as a whole. Meanwhile, it is preferable tomanufacture the exposure apparatus in a clean room in which, forexample, the temperature and the cleanliness level are controlled.

As shown in FIG. 19, a micro-device, such as a semiconductor device, ismanufactured by a step 201 of designing the functions and performance ofthe micro-device, a step 202 of manufacturing the mask (reticle) basedon this designing step, a step 203 of manufacturing the substrate P,which is the base material of the device, a substrate processing step204 of a substrate process (exposure process) that includes, inaccordance with the embodiments mentioned above, exposing the substrateP with the exposure light EL that is emitted from the pattern of themask M and developing the exposed substrate P, a device assembling step205 (which includes fabrication processes such as dicing, bonding, andpackaging processes), an inspecting step 206, and the like.

Meanwhile, the features of each of the embodiments mentioned above canbe combined as appropriate. In addition, there may be cases in whichsome of the components are not used. In addition, each disclosure ofevery Japanese published patent application and U.S. patent elated tothe exposure apparatus recited in each of the embodiments, modifiedexamples, and the like discussed above is hereby incorporated byreference in its entirety to the extent permitted by national laws andregulations.

What is claimed is:
 1. A liquid immersion exposure apparatus comprising:a projection system having a last optical member via which exposurelight is projected; and a liquid immersion member which forms a liquidimmersion space under an emitting surface of the last optical member,wherein: the exposure light is projected to a substrate through liquidin the liquid immersion space to expose the substrate while thesubstrate is moved in a scanning direction, the liquid immersion memberincludes (i) a first member that has a liquid supply port and has anopening through which the exposure light is projected, and (ii) a secondmember that has a liquid recovery port facing downwardly and that ismovable with respect to the first member, the liquid recovery port has aplurality of openings disposed in a four-sided shaped to surround theopening of the first member, the four-sided shape has four corners,first and second corners of the four corners are opposite each other andare spaced from each other in a direction perpendicular to the scanningdirection, third and fourth corners of the four corners are oppositeeach other and are spaced from each other in a direction parallel to thescanning direction, and the second member is moved in a directionperpendicular to an optical axis of the last optical member so that arelative speed between the second member and an object is smaller than arelative speed between the first member and the object, while recoveringthe liquid in a gap between the second member and the object via theliquid recovery port of the second member.
 2. The immersion exposureapparatus according to claim 1, wherein the second member is movablebetween the first member and the object.
 3. The immersion exposureapparatus according to claim 1, wherein the second member is movedconcurrently with at least a portion of the movement of the object in astate where the liquid is present in at least a portion of the gapbetween the second member and the object.
 4. The immersion exposureapparatus according to claim 1, wherein the object includes thesubstrate and the second member is moved so that the relative speedbetween the second member and the substrate is smaller than the relativespeed between the first member and the substrate.
 5. The immersionexposure apparatus according to claim 1, wherein the second member ismoved concurrently with at least a portion of the exposure of thesubstrate in which the exposure light is projected to the substrate. 6.The immersion exposure apparatus according to claim 1, wherein thesecond member is moved concurrently with at least a portion of a stepmovement of the substrate between a completion of exposure of a shotarea of the substrate and a start of exposure of a next shot area of thesubstrate, each of the shot areas being exposed with the exposure light.7. The immersion exposure apparatus according to claim 1, wherein thefirst member is stationary relative to the last optical member.
 8. Theimmersion exposure apparatus according to claim 1, wherein the firstmember is disposed in a periphery of the last optical member with a gapbetween the first member and the last optical member.
 9. The immersionexposure apparatus according to claim 1, wherein the liquid supply portsupplies the liquid to a gap between the first member and the lastoptical member.
 10. The immersion exposure apparatus according to claim1, wherein the first member has a bottom surface in which the opening isformed and the liquid recovery port of the second member is arrangedradially outward of the bottom surface of the first member with respectto the opening.
 11. The immersion exposure apparatus according to claim1, wherein the liquid immersion space is formed so as to cover a portionof an upper surface of the substrate by recovering the liquid via theliquid recovery port of the second member during the exposure.
 12. Adevice manufacturing method comprising: exposing a substrate using theexposure apparatus defined in claim 1, and developing the exposedsubstrate.
 13. A liquid immersion exposure method comprising: forming aliquid immersion space using a liquid immersion member under an emittingsurface of a last optical member of a projection system; and exposing asubstrate with exposure light from the last optical member throughliquid in the liquid immersion space covering a portion of an uppersurface of the substrate, while moving the substrate in a scanningdirection, wherein the liquid immersion member includes (i) a firstmember that has a liquid supply port and has an opening through whichthe exposure light is projected, and (ii) a second member that has aliquid recovery port facing downwardly and that is movable with respectto the first member, the liquid recovery port has a plurality ofopenings disposed in a four-sided shaped to surround the opening of thefirst member, the four-sided shape has four corners, first and secondcorners of the four corners are opposite each other and are spaced fromeach other in a direction perpendicular to the scanning direction, thirdand fourth corners of the four corners are opposite each other and arespaced from each other in a direction parallel to the scanningdirection, and the second member is moved in a direction perpendicularto an optical axis of the last optical member so that a relative speedbetween the second member and the substrate is smaller than a relativespeed between the first member and the substrate, while recoveringliquid in a gap between the second member and the substrate via theliquid recovery port of the second member.
 14. The immersion exposuremethod according to claim 13, wherein the second member is movedconcurrently with at least a portion of the movement of the substrate ina state where the liquid is present in at least a portion of the gapbetween the second member and the substrate.
 15. The immersion exposuremethod according to claim 13, wherein the second member is movedconcurrently with at least a portion of the exposure of the substrate inwhich the exposure light is projected to the substrate.
 16. Theimmersion exposure method according to claim 13, wherein the secondmember is moved concurrently with at least a portion of a step movementof the substrate between a completion of exposure of a shot area of thesubstrate and a start of exposure of a next shot area of the substrate,each of the shot areas being exposed with the exposure light.
 17. Theimmersion exposure method according to claim 13, wherein the firstmember is stationary relative to the last optical member.
 18. Theimmersion exposure method according to claim 13, wherein the firstmember is disposed in a periphery of the last optical member with a gapbetween the first member and the last optical member.
 19. The immersionexposure method according to claim 15, wherein the liquid supply portsupplies the liquid to a gap between the first member and the lastoptical member.
 20. The immersion exposure method according to claim 13,wherein the first member has a bottom surface in which the opening isformed and the liquid recovery port of the second member is arrangedradially outward of the bottom surface of the first member with respectto the opening.
 21. The immersion exposure method according to claim 13,wherein the liquid immersion space is formed so as to cover a portion ofthe upper surface of the substrate by recovering the liquid via theliquid recovery port of the second member during the exposure.
 22. Adevice manufacturing method comprising: exposing a substrate using theexposure method defined in claim 13, and developing the exposedsubstrate.